Leaked A20 Pro Image Hints at iPhone 18 Pro Performance Gains

An alleged image of the iPhone 18 Pro motherboard has leaked online, showing the A20 Pro chip will use a new packaging technology that should offer notable performance gains over the previous model. The leaked image, which has been shared by the accounts "WHYLAB" and "Ice Universe" on Weibo, appears to show the A20 Pro chip integrated into TSMC's new packaging architecture, known as Wafer-Level Multi-Chip Module (WMCM) technology. Traditionally, Apple has used package-on-package (PoP) designs, where the DRAM sits directly on top of the application processor. The advantages of this method are lower power consumption and reduced latency, but it also makes heat concentrated in the packaging area. In the leaked WMCM implementation, by contrast, the DRAM has been moved to the side of the package, which should reduce thermal coupling between the processor and DRAM while improving heat dissipation during sustained workloads. Apple's design is also said to be equipped with LPDDR6